PHOTOCHUCKS

You want to upgrade your tool with the best possible photochuck available on the market?

Lithotools are the most capital-intensive tools in a semiconductor fab. Next to the optics, the Chuck itself can influence the yield and cost of ownership in a significant way. 

 

Your process and tool have the potential to run even smoother with optimized photochucks for next-generation lithography wafer-handling applications.  

anti-warp-photo-chuck.jpg
improved-edge-area-defocus-photo-chucks.

Anti-warp photochuck for superior clamping force 

Improved edge area defocus photochucks 

You will be able to: 

  • decrease backside particles for sensitive applications, due to lower contact ration (small pin size and wider pitch) 

  • higher edge yield, due to improved edge cell flatness and wider vacuum area 

  • performing durability of the initial flatness and yield improvement, due to superior surface roughness 

  • lower overlay value with superior global flatness and wider/stronger vacuum 

  • improve hardness and bending strength, with converting material from Quartz/Si-SiC TO SiC 

Technical capabilities OEM vs SPM modified photochuck 

Technical-capabilities-OEM-vs-SPM-modifi
pine-size-OEM-vs-SPM-modified-photo-chuc

Pine size OEM vs SPM modified photochuck

provided-local-cell-flatness.png

Provided local cell flatness on edge(20X20) under 0.15um whereas OEM 0.5um

Keyboard and Mouse

Let's comunicate!

For all the further information please contact Philipp Quaderer via mail: philipp@spm.li or via Phone: +4237928027.