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You want to upgrade your tool with the best possible photochuck available on the market?

Lithotools are the most capital-intensive tools in a semiconductor fab. Next to the optics, the Chuck itself can influence the yield and cost of ownership in a significant way. 


Your process and tool have the potential to run even smoother with optimized photochucks for next-generation lithography wafer-handling applications.  


Anti-warp photochuck for superior clamping force 

Improved edge area defocus photochucks 

You will be able to: 

  • decrease backside particles for sensitive applications, due to lower contact ration (small pin size and wider pitch) 

  • higher edge yield, due to improved edge cell flatness and wider vacuum area 

  • performing durability of the initial flatness and yield improvement, due to superior surface roughness 

  • lower overlay value with superior global flatness and wider/stronger vacuum 

  • improve hardness and bending strength, with converting material from Quartz/Si-SiC TO SiC 

Technical capabilities OEM vs SPM modified photochuck 


Pine size OEM vs SPM modified photochuck


Provided local cell flatness on edge(20X20) under 0.15um whereas OEM 0.5um

Keyboard and Mouse

Let's comunicate!

For all the further information please contact Philipp Quaderer via mail: or via Phone: +4237928027.

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