Are you using your photo chucks already over 15 years and you notice raising defocus issues and particles?
ESCs are one of the most expensive items in semiconductor tools so efficacy, yield improvements, and cost reduction are significant points to be taken into account.
We can provide you improved photo chucks for next-generation lithography wafer-handling applications.
Anti-warp photo chuck for superior clamping force
Improved edge area defocus photo chucks
You will be able to:
decrease backside particles for sensitive applications, due to lower contact ration (small pin size and wider pitch)
higher edge yield, due to improved edge cell flatness and wider vacuum area
performing durability of the initial flatness and yield improvement, due to superior surface roughness
lower overlay value with superior global flatness and wider/stronger vacuum
improve hardness and bending strength, with converting material from Quartz/Si-SiC TO SiC
Technical capabilities OEM vs SPM modified photo chuck
Pine size OEM vs SPM modified photo chuck
Provided local cell flatness on edge(20X20) under 0.15um whereas OEM 0.5um