SPUTTERING TARGETS & BONDING EXPERTISE
From material selection to finished bonded assemblies, covering every stage of your project.
ENGINEERED FOR YOUR DEPOSITION PROCESS
Repeatable layers, run after run. Compatible with EVATEC, AMAT, ANELVA, SPTS, UNAXIS and other major PVD platforms.
STANDARD SPUTTERING TARGETS
Planar and rotatable targets for optical, decorative, wear-resistant and functional coatings in standard and custom configurations.
HIGH-PURITY MATERIALS
Semiconductor-grade sputtering targets and evaporation materials with certified analysis for every order.
ROTATABLE CONFIGURATIONS
Monolithic, sprayed and bonded rotatable tubes developed for higher target utilization, longer campaign life and reliable process performance.
WHAT YOU GAIN
Shorter qualification cycles
Reliable process performance
Fast turnaround
Dedicated technical support
OEM compatibility
SPUTTERING TARGETS AND EVAPORATION MATERIALS
STANDARD SPUTTERING TARGETS
- Si ≥99.999% planar / ≥99.9% rotatable
- Nb ≥99.9% planar & rotatable
- Ta ≥99.95% planar & rotatable
- Al ≥99.99% planar & rotatable
- Ti ≥99.99% planar & rotatable
HIGH-PURITY MATERIALS
- Al, Al/Cu, Al/Si 99.95% – 99.999%
- Cu 99.99% – 99.999%
- Ti 99.99% – 99.995%
- NiV 99.999% – 99.9995%
- Ta 99.995% – 99.999%
- WTi, Cr, Ge, W, Ni
PRECIOUS MATERIALS
- Au 99.99% – 99.999%
- Ag 99.99% – 99.999%
- Pt 99.99% – 99.999%
- Ru 99.95% – 99.99%
Additional metals, alloys, oxides and fluorides available on request in a wide range of shapes and purities.
PROPRIETARY IN-HOUSE BONDING TECHNOLOGY
Developed in Japan, SPM’s proprietary pre-wetting process is material-independent and requires no metallization, delivering stable, void-free bonds.
Ultrasonic verification
Void-free bonding
No metallization
<1% scrap rate
Thin-film uniformity
RELIABILITY YOU CAN VERIFY
Supporting stable deposition from qualification to production.
INSPECTION & DOCUMENTATION
Dimensional, purity and ultrasonic bond verification with certificates for each delivery.
BUILT TO YOUR SPECIFICATION
Custom geometries, alloy development, prototype quantities and small production runs.
PROCESS SUPPORT
Application engineering for deposition rate, uniformity, arcing and target life improvement.
TARGET RECYCLING AND SCRAP MANAGEMENT
Recover value from spent targets through buy-back, rebonding and material recycling.
Fast buy-back
Fair market value
Backing plate reuse
Scrap recovery
Logistics support
SILICON SPUTTERING TARGETS
Unique sputtering target materials.
NIOBIUM
Sputtering targets for thin film.
AMO
Replace your precious metals with a unique silver alloy.
TNB
Higher index material than TiO2.
HPC
Copper coating which does not corrode.
ALLOYS
Sputtering targets with precise combination of metals.
