Substrates

SPM is able to supply various substrates:

Silicon
Glass
Quartz
Saphire
Indium Phosphide
Germanium
Gallium Phosphide

The thinning ranges from 76 - 300 mm (3 - 12 inch) to a thickness of less than 50 microns.

If you need other/more substrates, please contact SPM!

Glass Wafer

SPM provides glass wafers with diameters ranging from 50 mm up to 300 mm and thicknesses ranging from 10 mm down to 100 microns. Regarding surface finish different polishing grades, single-side polished, double-side polished or grinded wafers are available. Further specifications include total thickness variation and surface quality.

Depending on the application various different materials, e.g. borosilicate glass, fused silica or even ceramic types, may be chosen.

Laser engraving of the wafers is possible as well.

Carriers for Thin Wafers

Glass wafer

Typical Process Conditions:

Carrier material with CTE matching the thin (Si) wafer
Adequate surface properties and total thickness variation of the carrier
Optimum bonding and de-bonding between thin wafer and carrier
Carrier approach allows for thin wafers < 50 um
Multiple usage of carrier and low wafer breakage rate lead to high yield

Messen / Trade Shows

May 2012
15.-17.	E-MRS	Strasbourg, France
22.-25.	OPTATEC	Frankfurt, Germany
June 2012
19.-21.	Lope-C	Munich, Germany
September 2012
11.-12.	PSE 2012	Garmisch-Partenkirchen, Germany

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